CVE-2026-21370

نوع الضعف

Memory Corruption when validating input batch size and buffer plane count exceeds maximum allowed values.

المنتجات المتأثرة

• qualcomm fastconnect_6700_firmware
• qualcomm fastconnect_6700
• qualcomm fastconnect_6900_firmware
• qualcomm fastconnect_6900
• qualcomm fastconnect_7800_firmware
• qualcomm fastconnect_7800
• qualcomm g3x_gen_2_firmware
• qualcomm g3x_gen_2

المراجع

• https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2026-bulletin.html