CVE-2026-21374

نوع الضعف

Memory Corruption when processing auxiliary sensor input/output control commands with insufficient buffer size validation.

المنتجات المتأثرة

• qualcomm sm6250_firmware
• qualcomm sm6250
• qualcomm snapdragon_460_mobile_platform_firmware
• qualcomm snapdragon_460_mobile_platform
• qualcomm snapdragon_662_mobile_platform_firmware
• qualcomm snapdragon_662_mobile_platform
• qualcomm snapdragon_7c_compute_platform_firmware
• qualcomm snapdragon_7c_compute_platform

المراجع

• https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2026-bulletin.html